Global Ceramic Substrates in Electronic Packaging Industry Outlook 2022: Overview, Opportunities, Key Companies and Forecast to 2028
Executive Summary
According to GRD Survey data, the global Ceramic Substrates in Electronic Packaging market is estimated at million US$ in 2021 and is expected to reach million US$ by the end of 2028, growing at a CAGR of % in the forecast period between 2022 and 2028.
This report studies the Ceramic Substrates in Electronic Packaging market dynamics from angles such as new entries, mergers and acquisitions, fundings, exit and major technology breakthroughs. Market performance is evaluated through market size (value and volume) by players, regions, product types and end industries. This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Ceramic Substrates in Electronic Packaging in these regions, from 2017 to 2028, covering
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Italy, Spain and Russia, etc.)
Asia-Pacific (China, Japan, Korea, Southeast Asia, India, Australia)
South America (Brazil, Argentina, Colombia, etc.)
Middle East and Africa (Turkey, Saudi Arabia, South Africa, etc.)
Market Snapshot, By Product Type
Alumina(Al2O3)
Aluminium Nitride(AlN)
Beryllium Oxide(BeO)
Silicon Nitride(Si3N4)
Market Snapshot, By Application
Power Electronics
Electronic Packaging
Hybrid Microelectronics
Multi-Chip Modules
Main Market Players Analyzed in this report, including:
TOSHIBA
Tong Hsing Electronic Industries
TA-I Technology
Rogers Germany
Ortech Advanced Ceramics
NIKKO
Murata Manufacturing
Maruwa
Leatec Fine Ceramics
Kyocera
KOA Speer Electronics
ICP TECHNOLOGY
CoorsTek
Chaozhou Three-Circle
CeramTec
Anaren
The study objectives of this report are:
To study and analyze the global Ceramic Substrates in Electronic Packaging market size (value & volume) by company, key regions/countries, products and application, history data from 2017 to 2021, and forecast to 2028.
To understand industry structure of Ceramic Substrates in Electronic Packaging market by identifying its various subsegments.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To identify the key global Ceramic Substrates in Electronic Packaging manufacturers and regional typical players, to define, describe and analyze their sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Ceramic Substrates in Electronic Packaging market with respect to individual growth trends, future prospects, and their contribution to the total market.
To project the value and volume of Ceramic Substrates in Electronic Packaging submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of Ceramic Substrates in Electronic Packaging are as follows:
History Year: 2017-2021
Base Year: 2021
Estimated Year: 2022
Forecast Year 2023 to 2028
This report includes the estimation of market size in terms of value (million USD) and volume from top-down approach by analyzing major submarkets and their major driving factors, and verified from bottom-up approaches. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified from primary sources.
For the data information by region, company, type and application, 2021 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Key Stakeholders Considered in the study:
Raw material vendors
Distributors/traders/wholesalers/suppliers
Regulatory authorities, including government agencies and NGO
Commercial research & development (R&D) institutions
Importers and exporters
Government organizations, research organizations, and consulting firms
Trade/Industrial associations
End-use industries
Table of Content
Global Ceramic Substrates in Electronic Packaging Industry Outlook 2022: Overview, Opportunities, Key Companies and Forecast to 2028.pdf
List of Figure
Table of Contents
1 Market Definition & Scope
1.1 Definition & Scope
1.2 Ceramic Substrates in Electronic Packaging Product Specifications
1.3 Main Events (Entry, M&A, Exit, Technology and Capital Activity)
1.4 Global Ceramic Substrates in Electronic Packaging Market Performance and Outlook
2 Market Development Performance under COVID-19
2.1 Influencing Factors of Industry Development in the Next Five Years
2.1.1 Drivers
2.1.2 Restraints
2.1.3 Opportunities
2.2 Porter’s Five Forces Analysis
2.3 Comparison of Alternatives and Ceramic Substrates in Electronic Packaging
3 Supply Chain and Manufacturing Cost Analysis
3.1 Supply Chain Analysis
3.2 Raw Materials and Key Suppliers Analysis
3.2.1 Raw Materials Introduction
3.2.1 Raw Materials Key Suppliers List
3.3 Ceramic Substrates in Electronic Packaging Sales Channel and Distributors Analysis
3.3.1 Ceramic Substrates in Electronic Packaging Sales Channel
3.3.2 Ceramic Substrates in Electronic Packaging Distributors
3.4 Key Buying Industries/Consumers
3.4.1 Major Buyers in Power Electronics
3.4.2 Major Buyers in Electronic Packaging
3.5 Ceramic Substrates in Electronic Packaging Manufacturing Cost Structure Analysis
4 Market Segment: by Type
4.1 Ceramic Substrates in Electronic Packaging Type Introduction
4.1.1 Alumina(Al2O3)
4.1.2 Aluminium Nitride(AlN)
4.1.3 Beryllium Oxide(BeO)
4.1.4 Silicon Nitride(Si3N4)
4.2 Global Ceramic Substrates in Electronic Packaging Sales by Type 2017-2022
4.3 Global Ceramic Substrates in Electronic Packaging Revenue by Type 2017-2022
4.4 Global Ceramic Substrates in Electronic Packaging Price by Type 2017-2022
5 Market Segment: by Application
5.1 Ceramic Substrates in Electronic Packaging Type Introduction
5.1.1 Power Electronics
5.1.2 Electronic Packaging
5.1.3 Hybrid Microelectronics
5.1.3 Multi-Chip Modules
5.2 Global Ceramic Substrates in Electronic Packaging Sales by Application 2017-2022
5.3 Global Ceramic Substrates in Electronic Packaging Revenue by Application 2017-2022
5.4 Global Ceramic Substrates in Electronic Packaging Price by Application 2017-2022
6 Marke Segment: by Region
6.1 Global Ceramic Substrates in Electronic Packaging Market by Region
6.1.1 Global Ceramic Substrates in Electronic Packaging Sales by Regions
6.1.2 Global Ceramic Substrates in Electronic Packaging Revenue by Regions
6.2 North America Ceramic Substrates in Electronic Packaging Market 2017-2022
6.3 Europe Ceramic Substrates in Electronic Packaging Market 2017-2022
6.4 Asia Pacific Ceramic Substrates in Electronic Packaging Market 2017-2022
6.5 South America Ceramic Substrates in Electronic Packaging Market 2017-2022
6.6 Middle East and Africa Ceramic Substrates in Electronic Packaging Market 2017-2022
7 North America
7.1 North America Ceramic Substrates in Electronic Packaging Market by Country 2017-2022
7.1.1 North America Ceramic Substrates in Electronic Packaging Sales by Country
7.1.2 North America Ceramic Substrates in Electronic Packaging Revenue by Country
7.2 United States
7.3 Canada
7.4 Mexico
8 Europe
8.1 Europe Ceramic Substrates in Electronic Packaging Market by Country 2017-2022
8.1.1 Europe Ceramic Substrates in Electronic Packaging Sales by Country
8.1.2 Europe Ceramic Substrates in Electronic Packaging Revenue by Country
8.2 Germany
8.3 France
8.4 UK
8.5 Italy
8.6 Russia
8.7 Spain
9 Asia Pacific
9.1 Asia Pacific Ceramic Substrates in Electronic Packaging Market by Country 2017-2022
9.1.1 Asia Pacific Ceramic Substrates in Electronic Packaging Sales by Country
9.1.2 Asia Pacific Ceramic Substrates in Electronic Packaging Revenue by Country
9.2 China
9.3 Japan
9.4 Korea
9.5 Southeast Asia
9.6 India
9.7 Australia
10 South America
10.1 South America Ceramic Substrates in Electronic Packaging Market by Country 2017-2022
10.1.1 South America Ceramic Substrates in Electronic Packaging Sales by Country
10.1.2 South America Ceramic Substrates in Electronic Packaging Revenue by Country
10.2 Brazil
10.3 Argentina
10.4 Colombia
11 Middle East and Africa
11.1 Middle East and Africa Ceramic Substrates in Electronic Packaging Market by Country 2017-2022
11.1.1 Middle East and Africa Ceramic Substrates in Electronic Packaging Sales by Country
11.1.2 Middle East and Africa Ceramic Substrates in Electronic Packaging Revenue by Country
11.2 Turkey
11.3 Saudi Arabia
11.4 South Africa
12 Key Participants Company Information
12.1 TOSHIBA
12.1.1 TOSHIBA Company Information
12.1.2 TOSHIBA Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.1.3 TOSHIBA Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.1.4 TOSHIBA Key Development
12.2 Tong Hsing Electronic Industries
12.2.1 Tong Hsing Electronic Industries Company Information
12.2.2 Tong Hsing Electronic Industries Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.2.3 Tong Hsing Electronic Industries Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.2.4 Tong Hsing Electronic Industries Key Development
12.3 TA-I Technology
12.3.1 TA-I Technology Company Information
12.3.2 TA-I Technology Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.3.3 TA-I Technology Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.3.4 TA-I Technology Key Development
12.4 Rogers Germany
12.4.1 Rogers Germany Company Information
12.4.2 Rogers Germany Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.4.3 Rogers Germany Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.4.4 Rogers Germany Key Development
12.5 Ortech Advanced Ceramics
12.5.1 Ortech Advanced Ceramics Company Information
12.5.2 Ortech Advanced Ceramics Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.5.3 Ortech Advanced Ceramics Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.5.4 Ortech Advanced Ceramics Key Development
12.6 NIKKO
12.6.1 NIKKO Company Information
12.6.2 NIKKO Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.6.3 NIKKO Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.6.4 NIKKO Key Development
12.7 Murata Manufacturing
12.7.1 Murata Manufacturing Company Information
12.7.2 Murata Manufacturing Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.7.3 Murata Manufacturing Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.7.4 NIKKO Key Development
12.9 Leatec Fine Ceramics
12.9.1 Leatec Fine Ceramics Company Information
12.9.2 Leatec Fine Ceramics Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.9.3 Leatec Fine Ceramics Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.9.4 Leatec Fine Ceramics Key Development
12.8 Maruwa
12.8.1 Maruwa Company Information
12.8.2 Maruwa Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.8.3 Maruwa Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.8.4 Maruwa Key Development
12.11 KOA Speer Electronics
12.11.1 KOA Speer Electronics Company Information
12.11.2 KOA Speer Electronics Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.11.3 KOA Speer Electronics Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.11.4 KOA Speer Electronics Key Development
12.12 ICP TECHNOLOGY
12.12.1 ICP TECHNOLOGY Company Information
12.12.2 ICP TECHNOLOGY Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.12.3 ICP TECHNOLOGY Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.12.4 ICP TECHNOLOGY Key Development
12.13 CoorsTek
12.13.1 CoorsTek Company Information
12.13.2 CoorsTek Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.13.3 CoorsTek Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.13.4 CoorsTek Key Development
12.14 Chaozhou Three-Circle
12.14.1 Chaozhou Three-Circle Company Information
12.14.2 Chaozhou Three-Circle Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.14.3 Chaozhou Three-Circle Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.14.4 Chaozhou Three-Circle Key Development
12.15 CeramTec
12.15.1 CeramTec Company Information
12.15.2 CeramTec Ceramic Substrates in Electronic Packaging Product Portfolio, Specification and Application
12.15.3 CeramTec Ceramic Substrates in Electronic Packaging Sales, Price, Revenue and Gross Margin (2019-2021)
12.15.4 CeramTec Key Development
13 Global Ceramic Substrates in Electronic Packaging Market Forecast by Region by Type and by Application
13.1 Global Ceramic Substrates in Electronic Packaging Sales, Revenue Forecast 2023-2028
13.2 Global Ceramic Substrates in Electronic Packaging Forecast by Regions
13.2.1 Global Ceramic Substrates in Electronic Packaging Sales Forecast by Region 2023-2028
13.2.2 Global Ceramic Substrates in Electronic Packaging Revenue Forecast by Region 2023-2028
13.3 Global Ceramic Substrates in Electronic Packaging Forecast by Type
13.3.1 Global Ceramic Substrates in Electronic Packaging Sales Forecast by Type 2023-2028
13.3.2 Global Ceramic Substrates in Electronic Packaging Revenue Forecast by Type 2023-2028
13.3.3 Global Ceramic Substrates in Electronic Packaging Price Forecast by Type 2023-2028
13.4 Global Ceramic Substrates in Electronic Packaging Forecast by Application
13.4.1 Global Ceramic Substrates in Electronic Packaging Sales Forecast by Application 2023-2028
13.4.2 Global Ceramic Substrates in Electronic Packaging Revenue Forecast by Application 2023-2028
13.4.3 Global Ceramic Substrates in Electronic Packaging Price Forecast by Application 2023-2028
14 Analyst Views and Conclusions
15 Methodology and Data Source
15.1 Methodology
15.2 Research Data Source
15.2.1 Secondary Data
15.2.2 Primary Data
15.2.3 Market Size Estimation
15.3 Legal Disclaimer
Electronic and Semiconductor
Food and Beverages
Chemicals and Materials
Consumer Goods
Construction Manufacturing
Aerospace and Defence
Energy and Power
ICT Media
Banking and Finance
Automotive and Transportation
Machinery and Equipments
Pharmaceutical and Healthcare
Medical Devices